Koch Chemie One Cut Polish Pad

The Koch Chemie One Cut Polish Pad is a polishing pad with a unique foam structure that dissipates heat well during polishing, significantly reducing the risk of paint overheating. Thanks to the advanced cell structure, the pad spreads polishing compound evenly across the surface, giving a consistent and durable result when removing scratches, swirls and other paint imperfections. The pad suits both rotary and DA polishers and works with a wide range of polishing products from the Koch Chemie line. It is also washable and reusable, so you can use it multiple times without a drop in performance. Available in four sizes: 45, 80, 130 and 150 mm, matching your machine and backing plate.

What's inside

One polishing pad with a foam structure for heat dissipation, available in size 45 mm, suitable for rotary and DA polishers.

Why this product

• Optimal heat dissipation: foam structure limits the risk of paint overheating during polishing

• Even distribution: the cell structure spreads polishing compound across the whole surface for a consistent result

• Washable and reusable: multiple polishing sessions possible without a noticeable drop in performance

• Universally usable: suitable for both rotary and DA polishers

How to use

1. Attach the pad firmly to the backing plate of your polisher (Check that the size matches your backing plate.)

2. Apply a small amount of polishing compound evenly onto the pad (Too much product causes splatter and waste.)

3. Polish the panel in overlapping passes with even pressure (Keep the machine flat on the surface for the best result.)

4. Clean the pad thoroughly after use and let it dry fully (This keeps the foam structure intact for the next session.)

Pair the pad with the Koch Chemie Heavy Cut Polish H9.02 and a Liquid Elements polisher for a complete polishing result.